A reticle , on the other hand, referred to a single layer of pattern that covers a small portion of the wafer. A reticle has to be stepped and repeated in order to expose the entire wafer. In other words, compared to a reticle, a mask used to refer to a pattern that could be printed in a single exposure to cover the entire wafer without any optical de-magnification. Today, the terms are often used synonymously.
Masks are made using a photomask blank. Functional verification is used to determine if a design, or unit of a design, conforms to its specification. A statistical method for determining if a test system is production ready by measuring variation during test for repeatability and reproducibility.
Adding extra circuits or software into a design to ensure that if one part doesn't work the entire system doesn't fail. Optimizing the design by using a single language to describe hardware and software. A dense, stacked version of memory with high-speed interfaces that can be used in advanced packaging.
Synthesis technology that transforms an untimed behavioral description into RTL. Combines use of a public cloud service with a private cloud, such as a company's internal enterprise servers or data centers. A data center facility owned by the company that offers cloud services through that data center. IEEE Standards for coexistence between wireless standards of unlicensed devices. Enables broadband wireless access using cognitive radio technology and spectrum sharing in white spaces.
Specific requirements and special consideration for the Internet of Things within an Industrial settiong. A semiconductor company that designs, manufactures, and sells integrated circuits ICs. A design or verification unit that is pre-packed and available for licensing. Networks that can analyze operating conditions and reconfigure in real time. Buses, NoCs and other forms of connection between various elements in an integrated circuit.
Also known as the Internet of Everything, or IoE, the Internet of Things is a global application where devices can connect to a host of other devices, each either providing data from sensors, or containing actuators that can control some function. Data can be consolidated and processed on mass in the Cloud.
Injection of critical dopants during the semiconductor manufacturing process. Standard related to the safety of electrical and electronic systems within a car. Standard to ensure proper operation of automotive situational awareness systems. Device and connectivity comparisons between the layout and the schematic. A technical standard for electrical characteristics of a low-power differential, serial communication protocol.
An approach in which machines are trained to favor basic behaviors and outcomes rather than explicitly programmed to do certain tasks. That results in optimization of both hardware and software to achieve a predictable range of results. Observation related to the amount of custom and standard content in electronics.
A semiconductor device capable of retaining state information for a defined period of time. Microelectromechanical Systems are a fusion of electrical and mechanical engineering and are typically used for sensors and for advanced microphones and even speakers. Artificial materials containing arrays of metal nanostructures or mega-atoms. Observation that relates network value being proportional to the square of users. Metrology is the science of measuring and characterizing tiny structures and materials.
The integrated circuit that first put a central processing unit on one chip of silicon. A way of stacking transistors inside a single chip instead of a package.
An early approach to bundling multiple functions into a single package. Increasing numbers of corners complicates analysis. Concurrent analysis holds promise.
A durable and conductive material of two-dimensional inorganic compounds in thin atomic layers. A type of field-effect transistor that uses wider and thicker wires than a lateral nanowire.
A method of collecting data from the physical world that mimics the human brain. The ability of a lithography scanner to align and print various layers accurately on top of each other. Outlier detection for a single measurement, a requirement for automotive electronics.
Design and implementation of a chip that takes physical placement, routing and artifacts of those into consideration. PVD is a deposition method that involves high-temperature vacuum evaporation and sputtering.
Hardware Verification Language, PSS is defined by Accellera and is used to model verification intent in semiconductor design. Special flop or latch used to retain the state of the cell when its main power supply is shut off.
An integrated circuit that manages the power in an electronic device or module, including any device that has a battery that gets recharged. A power IC is used as a switch or rectifier in high voltage power applications. Fundamental tradeoffs made in semiconductor design for power, performance and area. Data centers and IT infrastructure for data storage and computing that a company owns or subscribes to for use only by that company.
A measurement of the amount of time processor core s are actively in use. An integrated circuit or part of an IC that does logic and math processing. Data storage and computing done in a data center, through a service offered by a cloud service provider, and accessed on the public Internet. An artificial neural network that finds patterns in data using other data stored in memory. Copper metal interconnects that electrically connect one part of a package to another. Design verification that helps ensure the robustness of a design and reduce susceptibility to premature or catastrophic electrical failures.
A proposed test data standard aimed at reducing the burden for test engineers and test operations. A series of requirements that must be met before moving past the RTL phase. Additional logic that connects registers into a shift register or scan chain for increased test efficiency. Sensors are a bridge between the analog world we live in and the underlying communications infrastructure.
A transmission system that sends signals over a high-speed connection from a transceiver on one chip to a receiver on another. The transceiver converts parallel data into serial stream of data that is re-translated into parallel on the receiving end. In semiconductor development flow, tasks once performed sequentially must now be done concurrently. When channel lengths are the same order of magnitude as depletion-layer widths of the source and drain, they cause a number of issues that affect design.
A class of attacks on a device and its contents by analyzing information using different access methods. A system on chip SoC is the integration of functions necessary to implement an electronic system onto a single substrate and contains at least one processor. Through-Silicon Vias are a technology to connect various die in a stacked die configuration. A type of transistor under development that could replace finFETs in future process technologies.
The Unified Coverage Interoperability Standard UCIS provides an application programming interface API that enables the sharing of coverage data across software simulators, hardware accelerators, symbolic simulations, formal tools or custom verification tools.
User interfaces is the conduit a human uses to communicate with an electronics device. A document that defines what functional verification is going to be performed. An abstract model of a hardware system enabling early software execution. The basic architecture for most computing today, based on the principle that data needs to move back and forth between a processor and memory.
Wired communication, which passes data through wires between devices, is still considered the most stable form of communication. A data-driven system for monitoring and improving IC yield and reliability. Search for:. Knowledge Center Navigation. Knowledge Center. A template of what will be printed on a wafer.
November 21st, July 19th, March 22nd, January 21st, July 23rd, March 16th, January 22nd, March 4th, March 3rd, October 24th, Show More ». Published on July 22, Published on June 1, Published on May 18, Published on April 29, Published on April 15, A brief history of design We start with schematics and end with ESL.
A brief history of logic simulation Important events in the history of logic simulation. A brief history of logic synthesis Early development associated with logic synthesis. Acronyms Commonly and not-so-commonly used acronyms. Advanced Smart Fill At newer nodes, more intelligence is required in fill because it can affect timing, signal integrity and require fill for all layers. Advanced Packaging A collection of approaches for combining chips into packages, resulting in lower power and lower cost.
Agile An approach to software development focusing on continual delivery and flexibility to changing requirements. Agile Hardware Development How Agile applies to the development of hardware systems. Air Gap A way of improving the insulation between various components in a semiconductor by creating empty space. Ambient Intelligence A collection of intelligent electronic environments. Analog Semiconductors that measure real-world conditions.
Analog circuits Analog integrated circuits are integrated circuits that make a representation of continuous signals in electrical form. Analog Design and Verification The design and verification of analog components.
Application Programming Interface API A software tool used in software programming that abstracts all the programming steps into a user interface for the developer. Application specific integrated circuit ASIC A custom, purpose-built integrated circuit made for a specific task or product. Artificial Intelligence AI Using machines to make decisions based upon stored knowledge and sensory input.
Assertion Code that looks for violations of a property. Automotive Issues dealing with the development of automotive electronics. Avalanche Noise Noise in reverse biased junctions. AVM Verification methodology created by Mentor. Band gap. Batteries Devices that chemically store energy.
Biometrics Security based on scans of fingerprints, palms, faces, eyes, DNA or movement. Blech Effect A reverse force to electromigration. Bluetooth Low Energy Also known as Bluetooth 4. BSIM Transistor model. Built-in self-test BiST On-chip logic to test a design. Bus Functional Model Interface model between testbench and device under test. Cache Coherent Interconnect for Accelerators CCIX Interconnect standard which provides cache coherency for accelerators and memory expansion peripheral devices connecting to processors.
CAN bus Automotive bus developed by Bosch. Cell-Aware Test Fault model for faults within cells. Checker Testbench component that verifies results. Chip Design Design is the process of producing an implementation from a conceptual form. Chip Design and Verification The design, verification, implementation and test of electronics systems into integrated circuits. Clock Gating Dynamic power reduction by gating the clock. Clock Tree Optimization Design of clock trees for power reduction.
Cloud The cloud is a collection of servers that run Internet software you can use on your device or computer. CMOS Fabrication technology.
Cobalt Cobalt is a ferromagnetic metal key to lithium-ion batteries. Code Coverage Metrics related to about of code executed in functional verification. Combinatorial Equivalence Checking Verify functionality between registers remains unchanged after a transformation.
Communications The plumbing on chip, among chips and between devices, that sends bits of data and manages that data. Communications systems. Compiled-code Simulation Faster form for logic simulation. Contact The structure that connects a transistor with the first layer of copper interconnects. Coverage Completion metrics for functional verification. Crosstalk Interference between signals.
Crypto processors Crypto processors are specialized processors that execute cryptographic algorithms within hardware. Dark Silicon A method of conserving power in ICs by powering down segments of a chip when they are not in use.
Data Centers A data center is a physical building or room that houses multiple servers with CPUs for remote data storage and processing.
Data processing Data processing is when raw data has operands applied to it via a computer or server to process data into another useable form. De Facto Standards A standard that comes about because of widespread acceptance or adoption. Debug The removal of bugs from a design. Deep Learning DL Deep learning is a subset of artificial intelligence where data representation is based on multiple layers of a matrix.
Design for Manufacturing DFM Actions taken during the physical design stage of IC development to ensure that the design can be accurately manufactured. Design for Test DFT Techniques that reduce the difficulty and cost associated with testing an integrated circuit. Design Patent Protection for the ornamental design of an item. Design Rule Checking DRC A physical design process to determine if chip satisfies rules defined by the semiconductor manufacturer. Design Rule Pattern Matching Locating design rules using pattern matching techniques.
Device Noise Sources of noise in devices. Diamond Semiconductors A wide-bandgap synthetic material. Digital Oscilloscope Allowed an image to be saved digitally. Digital Twins A digital representation of a product or system. DNA Chips Using deoxyribonucleic acid to make chips hacker-proof. Double Patterning A patterning technique using multiple passes of a laser. Double Patterning Methodologies Colored and colorless flows for double patterning.
E-beam Inspection A slower method for finding smaller defects. E-Beam Lithography Lithography using a single beam e-beam tool. Edge Computing. Electromigration Electromigration EM due to power densities. Emulation Special purpose hardware used for logic verification. Energy Harvesting Capturing energy from the environment. Environmental Noise Noise caused by the environment. Epitaxy A method for growing or depositing mono crystalline films on a substrate.
Ethernet Ethernet is a reliable, open standard for connecting devices by wire. Fabless Semiconductor Companies. Failure Analysis Finding out what went wrong in semiconductor design and manufacturing. Fan-Outs A way of including more features that normally would be on a printed circuit board inside a package.
Fault Simulation Evaluation of a design under the presence of manufacturing defects. Femtocells The lowest power form of small cells, used for home WiFi networks. Fill The use of metal fill to improve planarity and to manage electrochemical deposition ECD , etch, lithography, stress effects, and rapid thermal annealing.
FinFET A three-dimensional transistor. Flash Memory non-volatile, erasable memory. Flicker Noise Noise related to resistance fluctuation. Flip-Chip A type of interconnect using solder balls or microbumps. Formal Verification Formal verification involves a mathematical proof to show that a design adheres to a property.
Functional Coverage Coverage metric used to indicate progress in verifying functionality. Functional Design and Verification Functional Design and Verification is currently associated with all design and verification functions performed before RTL synthesis.
Functional Verification Functional verification is used to determine if a design, or unit of a design, conforms to its specification. Gate-Level Power Optimizations Power reduction techniques available at the gate level. Generation-Recombination Noise noise related to generation-recombination. Germany Germany is known for its automotive industry and industrial machinery. Graphene 2D form of carbon in a hexagonal lattice.
Guard Banding Adding extra circuits or software into a design to ensure that if one part doesn't work the entire system doesn't fail. Hardware Assisted Verification Use of special purpose hardware to accelerate verification.
Hardware Modeler Historical solution that used real chips in the simulation process. Heat Dissipation Power creates heat and heat affects power. High-Bandwidth Memory HBM A dense, stacked version of memory with high-speed interfaces that can be used in advanced packaging. Hybrid Cloud Combines use of a public cloud service with a private cloud, such as a company's internal enterprise servers or data centers.
Hyperscale Data Centers A data center facility owned by the company that offers cloud services through that data center. IC Types What are the types of integrated circuits? Impact of lithography on wafer costs Wafer costs across nodes. Implementation Power Optimizations Power optimization techniques for physical implementation. In-Memory Computing Performing functions directly in the fabric of memory. Induced Gate Noise Thermal noise within a channel. Integrated Circuits ICs Integration of multiple devices onto a single piece of semiconductor.
Intellectual Property IP A design or verification unit that is pre-packed and available for licensing. Intelligent Self-Organizing Networks Networks that can analyze operating conditions and reconfigure in real time. Inter Partes Review Method to ascertain the validity of one or more claims of a patent.
Internet of Things IoT Also known as the Internet of Everything, or IoE, the Internet of Things is a global application where devices can connect to a host of other devices, each either providing data from sensors, or containing actuators that can control some function.
Interposers Fast, low-power inter-die conduits for 2. Ion Implants Injection of critical dopants during the semiconductor manufacturing process. IR Drop The voltage drop when current flows through a resistor. ISO — Functional safety Standard related to the safety of electrical and electronic systems within a car. Languages Languages are used to create models.
Level Shifters Cells used to match voltages across voltage islands. LIN bus Low cost automotive bus. Lint Removal of non-portable or suspicious code. Litho Freeze Litho Etch A type of double patterning. Lithography Light used to transfer a pattern from a photomask onto a substrate. Lithography k1 coefficient Coefficient related to the difficulty of the lithography process. Logic Resizing Correctly sizing logic elements. Logic Restructuring Restructuring of logic for power reduction.
Logic Simulation A simulator is a software process used to execute a model of hardware. Low Power. Low Power Methodologies Methodologies used to reduce power consumption. Low Power Verification Verification of power circuitry. Low-Power Design. LVDS low-voltage differential signaling A technical standard for electrical characteristics of a low-power differential, serial communication protocol.
Machine Learning ML An approach in which machines are trained to favor basic behaviors and outcomes rather than explicitly programmed to do certain tasks. Manufacturing Noise Noise sources in manufacturing. Materials Semiconductor materials enable electronic circuits to be constructed.
Memory A semiconductor device capable of retaining state information for a defined period of time. Memory Banking Use of multiple memory banks for power reduction. MEMS Microelectromechanical Systems are a fusion of electrical and mechanical engineering and are typically used for sensors and for advanced microphones and even speakers.
Metamaterials Artificial materials containing arrays of metal nanostructures or mega-atoms. Metastability Unstable state within a latch. Methodologies and Flows Describes the process to create a product. Metrology Metrology is the science of measuring and characterizing tiny structures and materials.
Microcontroller MCU. Microprocessor, Microprocessor Unit MPU The integrated circuit that first put a central processing unit on one chip of silicon. Mixed-Signal The integration of analog and digital. Models and Abstractions Models are abstractions of devices. Monolithic 3D Chips A way of stacking transistors inside a single chip instead of a package. Mote A mote is a micro-sensor. Multi-Beam e-Beam Lithography An advanced form of e-beam lithography.
Multi-site testing Using a tester to test multiple dies at the same time. Multi-Vt Use of multi-threshold voltage devices. Multiple Patterning A way to image IC designs at 20nm and below. MXenes A durable and conductive material of two-dimensional inorganic compounds in thin atomic layers. Nanoimprint Lithography A hot embossing process type of lithography. Nanosheet FET A type of field-effect transistor that uses wider and thicker wires than a lateral nanowire. Near Threshold Computing Optimizing power by computing below the minimum operating voltage.
Near-Memory Computing Moving compute closer to memory to reduce access costs. Neural Networks A method of collecting data from the physical world that mimics the human brain.
Neuromorphic Computing A compute architecture modeled on the human brain. Parts of a Photomask. Home » Learning Center » Parts of a Photomask. Previous Next. View Larger Image. DIE A die is a single complete device image. Scribe lines. Example of 1X Master array. Example of 5X Reticle mask. ROW A row consists of a horizontal line of dice on the photomask. Mask Fiducials. Reference mark. Typical Example of geometry used as CD 1. Examples of Registration.
Compugraphics makes a wide range of reticles and can advise customers on the additional patterns that need to be added. So what is a Photomask? How is a Photomask Used?
0コメント